Smart IC Chip

Package: DIP, SOP, QFP, BGA

Protocol: IEEE802.3/IEEE802.11

Output Current: 1mA To 20mA

Package Type: DIP, SOP, QFP, BGA, Etc.

Package: DIP, SOP, QFP, BGA, Etc.

Size: Small, Medium, Large

Manufacturer: Intel, AMD, Texas Instruments, Etc.

Package: DIP, SOP, QFP, BGA, Etc.

Operating Temperature: -40℃ To 85℃

Operating Voltage: 3.3V, 5V, 12V, 24V

Operating Voltage: 1.2V-3.3V

Package: DIP, SOP, QFP, BGA, Etc.

Memory: SRAM, ROM, Flash, Etc.

Package: SMD, DIP, QFP, BGA, Etc.

Interface: SPI, I2C, UART, Etc.

Manufacturer: Intel, AMD, Samsung, Etc.

Life: 10 Years, 20 Years, Etc.

Package: DIP, SOP, QFP, BGA, Etc.

Interface: SPI, I2C, UART, Etc.

Material: Silicon, Gold, Copper, Etc.

Application: Computer, Automobile, Etc.

Brand: Intel, AMD, ST, TI, Etc.

Manufacturer: TI, ST, NXP, Etc.

Package: DIP, SOIC, QFP, BGA, Etc.

Durability: High

Operating Temperature: Wide Range

Packaging Details: Tray

Delivery Time: In stock

Material: Silicon, GaAs, Etc.

Operating Temperature: -40℃~125℃

XILINX: XC6SLX45-2CSG324C

TI: TPS51200DRCR