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Data Rate: Up To 10Gbps

Number Of Gates: Up To 2.3M

Lead Finish: Gold Plated

Mounting Type: Surface Mount

Data Rate: Up To 10Gbps

Package: QFN, BGA, VFBGA, Etc.

Operating Temperature: -40°C To +85°C

Package: QFP, BGA, PQFP, Etc.

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1.8V 48CSBGA XILINX IC

32M PROM XILINX IC

XILINX XCF32PFSG48C

Packaging Details: Tray

Interface: I2C, SPI, UART, USB, Etc.

Package: DIP, SOIC, SSOP, QFN, BGA, Etc.

Mounting Type: Surface Mount

Output Signal Type: Differential

Interface: SPI, I2C, UART, USB

Memory: SRAM, DRAM, Flash

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8NPN chips integrated circuits

50V chips integrated circuits

ULN2803ADWR

Packaging Details: rewind,shear zone

Integrated Peripherals: ADC, DAC, PWM, Etc.

Interface Type: I2C, SPI, UART, Etc.

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256KB Texas Instruments IC Chips

100TQFP Texas Instruments IC Chips

ATMEGA2560-16AU

Packaging Details: Tray

Interface: Serial, Parallel, USB, Etc.

Package: DIP, SOIC, QFP, BGA, Etc.

Interface: I2C, SPI, UART, Etc.

Power Consumption: Low, Medium, High, Etc.

TI: TMS320LF2406APZA

XILINX: XC6SLX9-2CSG225C

TI: LMZ31710RVQR

XILINX: XC6SLX9-2CSG225C

XILINX: XC6SLX9-2TQG144I

TI: TPS54160DGQR